Method for manufacturing conductive wafers, method for manufacturing thin-plate sintered compacts, method for manufacturing ceramic substrates for thin-film magnetic head, and method for machining conductive wafers
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United States of America Patent
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Jun 5, 2001
Grant Date -
N/A
app pub date -
Jan 13, 1999
filing date -
Jul 29, 1998
priority date (Note) -
Expired
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Abstract
A method for manufacturing thin-plate sintered compacts according to the present invention includes the steps of: forming a conductive sintered compact to have such a thickness as to cause a warp to a negligible degree; and slicing the conductive sintered compact, thereby cutting and dividing the conductive sintered compact into at least two wafers.
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