Semiconductor device manufacturing method, press die and guide rail including forming a crack perpendicular to an extension of the sealing resin
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United States of America Patent
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-
Jun 5, 2001
Grant Date -
N/A
app pub date -
Mar 20, 1998
filing date -
Oct 3, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided are a method for manufacturing a semiconductor device in which a sealing resin is prevented from being damaged and generation of a resin piece is suppressed, a press die for suppressing the generation of the resin piece, and a guide rail. A frame receiving die (11) includes a cavity (11d) having a rectangular contour shape seen on a plane which serves to house a sealing resin (3) therein, and a remaining gate housing section (11c) provided on any of four corners of the cavity (11d) corresponding to a remaining gate (3b) on a lower face of a corner (2a) of a lead frame (2). A lower gate punch (11a) is provided in a boundary portion between the cavity (11d) and the remaining gate housing section (11c). When the lead frame (2) is mounted on the frame receiving die (11), the sealing resin (3) is housed in the cavity (11d) and the remaining gate (3b) is housed in the remaining gate housing section (11c).
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