Ceria powder
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United States of America Patent
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May 29, 2001
Grant Date -
N/A
app pub date -
Apr 21, 2000
filing date -
Jun 16, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A polishing slurry, useful in optical or CMP applications, comprises a ceria with a BET surface area of at least 10 m.sup.2 /gm. The slurry may be made by subjecting a commercial ceria slurry comprising agglomerates to a mechano-chemical treatment at a pH of from 9 to 11 using media that are low purity alpha alumina or zirconia. Preferred slurries maintain a positive surface charge at all pH values. CMP slurries preferably comprise in addition an anionic surfactant to aid in removal of surface residues.
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