Apparatus and method for testing strength of electrical bond sites on semiconductor devices
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United States of America Patent
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May 29, 2001
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N/A
app pub date -
Dec 9, 1998
filing date -
Dec 13, 1997
priority date (Note) -
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Abstract
A test device for applying a tensile force to electrical bond sites of a semiconductor device includes jaws (21), adapted to closely engage the surface of the bond site, typically a solder ball (22), while an inner edge portion (23) of each jaw approaches the jaw axis. By closely confining the bond site, the clamping forces exerted can be increased without risk that the bond site will be crushed. In a preferred embodiment the jaws permit slight reshaping of the bond site to increase the area of engagement therewith.
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