Heat exchanger for cooling semi-conductor components
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United States of America Patent
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-
May 22, 2001
Grant Date -
N/A
app pub date -
Apr 5, 1996
filing date -
May 4, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Heat exchanger for cooling semi-conductor components or the like equipment features cooling fins that are spaced apart, attached to and project out from a base section of extruded aluminum or another light metal, each fin being secured in a groove or the like recess in the base section. The cooling fins are in the form of a cooling-fin plates made of thin-gauge strips of material and, as viewed in longitudinal cross-section, are profiled at least in the region where they join the base section.
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