Lead frame for semiconductor device
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United States of America Patent
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May 15, 2001
Grant Date -
N/A
app pub date -
May 21, 1999
filing date -
May 21, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A lead frame for semiconductor devices including a metal substrate having inner leads and outer leads, a nickel thin layer formed on the metal substrate, an outer layer formed of palladium or a palladium alloy on the nickel thin layer, and a protection layer formed of gold or platinum between the nickel thin layer and the outer layer.
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