Method and apparatus for metal oxide chemical vapor deposition on a substrate surface
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United States of America Patent
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May 15, 2001
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N/A
app pub date -
Mar 18, 1999
filing date -
Mar 18, 1999
priority date (Note) -
Expired
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Abstract
A method and apparatus for improved metal oxide chemical vapor deposition on a substrate surface where the application boundary layer is reduced and where the uniformity of the application boundary layer is greatly enhanced in a reactor. Primary and secondary sonic or other disturbance sources are incorporated for introducing disturbance into the interior chamber of the reactor, or an oscillating or vibrating chuck is incorporated within the interior chamber, to influence the boundary layer thickness and uniformity.
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