Electrolytic Copper foil and process for producing the same

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United States of America Patent

PATENT NO 6231742
SERIAL NO

09088111

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Abstract

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In a process for the production of an electrolytic copper foil from a sulfurically acidic copper sulfate electrolytic solution, the sulfurically acidic copper sulfate electrolytic solution contains additives of 0.1 to 1.0 g/l of an oxyethylenic surfactant, 50 to 250 mg/l of a chloride, 1 to 10 mg/l of a glue or gelatin and 1 to 10 mg/l of a nitrogen-containing organic compound.

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Patent Owner(s)

Patent OwnerAddress
FUKUDA METAL FOIL & POWDER CO LTDKYOTO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Manabe, Hisanori Kyoto, JP 2 23
Miyamae, Kazuo Kyoto, JP 1 21
Sano, Yasushi Kyoto, JP 44 178
Yamada, Katsunori Kyoto, JP 30 370

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