Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate
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United States of America Patent
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May 8, 2001
Grant Date -
N/A
app pub date -
Sep 21, 1999
filing date -
Jan 21, 1998
priority date (Note) -
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Abstract
A base plate for a printed circuit board, having a conductive foil heat-bonded to at least one side of a film insulator which comprises from 65 to 35 wt % of a polyarylketone resin and from 35 to 65 wt % of a non-crystalline polyether imide resin and of which the glass transition temperature is from 150 to 230.degree. C. and the peak temperature of crystal fusion is at least 260.degree. C., as measured when the temperature is raised in the differential scanning calorimetry, if necessary after forming a through-hole and filling a conductive paste therein, and of which, after the heat bonding, the heat of crystal fusion .DELTA.Hm and the heat of crystallization .DELTA.Hc generated by crystallization during the temperature rise, as measured when the temperature is raised by the differential scanning calorimetry, satisfy the following relation: [(.DELTA.Hm-.DELTA.Hc)/.DELTA.Hm].ltoreq.0.5.
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