Cement bonded wood chip product, resin bonded wood chip product, simulated wood product and manufacturing method thereof

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United States of America Patent

PATENT NO 6228301
SERIAL NO

09288855

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Abstract

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A manufacturing method of a simulated wood product utilizing pulverized powders obtained from recycled building members as raw material, in which the building members have recycled wooden members made of wooden materials and resinous members made of resinous materials, the manufacturing method further including a mixing process for mixing the recycled wooden members, a pulverization process for pulverizing the mixed materials obtained in the mixing process to form pulverized powder, a kneading process for kneading the pulverized powders obtained by the pulverizing process, and a molding process for molding the kneaded materials obtained in the kneading process either by an extrusion or injection molding.

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Patent Owner(s)

Patent OwnerAddress
MISAWA HOMES CO LTDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Taguchi, Hidenori Tokyo, JP 15 203
Umemura, Keishiro Tokyo, JP 2 63

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