Friction hinge having high thermal conductivity
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United States of America Patent
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May 1, 2001
Grant Date -
N/A
app pub date -
Jun 8, 1999
filing date -
Jun 8, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention is a friction hinge assembly for a laptop computer which has a high thermal conductivity. The assembly includes a base element, a base element fixed to the base of the computer and to which an axially aligned base heat pipe is coupled. The assembly also includes a lid element fixed to the lid of the computer. The lid element has a body portion and a rotatable sleeve attached to the lid and which receives a lid heat pipe. The base and lid elements are pre-assembled selectively fastenable to one another for ease of assembly of the lid to the base, and in order to control the frictional torque produced by the hinge during operation.
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