Low temperature coefficient leadframe
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United States of America Patent
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May 1, 2001
Grant Date -
N/A
app pub date -
Feb 29, 2000
filing date -
Feb 29, 2000
priority date (Note) -
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Abstract
A leadframe is provided which has an integrated resistive element incorporated within the leadframe. The resistive element suitably comprises a material that can provide a temperature coefficient of under 500 ppm/.degree. C., preferably approximating 100 ppm/.degree. C. or less. Exemplary embodiments of the resistive material may include Constantan or Manganin. The leadframe and integrated resistive element may be utilized in a variety of integrated circuit applications, such as a current monitoring circuit. Accordingly, variations in temperature will not dramatically affect the accuracy of any integrated circuit devices during operation. Additionally, after encapsulation of the leadframe and integrated resistive element and any such integrated circuit device, the gain of the encapsulated circuit may be suitably adjusted by various calibration techniques.
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