Deposition of silver layer on nonconducting substrate
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United States of America Patent
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-
May 1, 2001
Grant Date -
N/A
app pub date -
Aug 13, 1999
filing date -
May 4, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group or gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform-films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.
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