Cup-type plating method and cleaning apparatus used therefor
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United States of America Patent
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May 1, 2001
Grant Date -
N/A
app pub date -
Dec 3, 1998
filing date -
Apr 3, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
It is an object of the present invention to provide a technology capable of plating satisfactorily even when wafers with a seed metal is plated in sequence by utilizing a cup-type plating apparatus. Plating solution adhered on a support 2 is removed between an initial and a subsequent plating processes by a cleaning apparatus 5 for a support 2 on a cup-type plating tank. The cleaning apparatus 5 comprises a first arm 9 of which distal end is positionable at the center of an upper portion of an opening of a plating tank 1, and a second aim 12 which is mounted at one end thereof to the distal end of the first arm 9, is provided at the other end thereof with a cleaner 11 and is pivotal about the distal end of the first arm 9.
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