Method for providing an electrical ground connection between a printed circuit board and a metallic substrate
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United States of America Patent
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May 1, 2001
Grant Date -
N/A
app pub date -
May 28, 1998
filing date -
May 28, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises the steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of a metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.
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