Crosslinkable polymer compounds for lead wire insulation, gaskets and liners in a refrigeration environment
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United States of America Patent
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Apr 24, 2001
Grant Date -
N/A
app pub date -
Aug 12, 1999
filing date -
Aug 12, 1999
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Expired
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Abstract
Insulation compounds are described that have been formulated for use in a refrigeration environment. The materials consist of crosslinkable compounds made from ionomer (EAS), polyether block amide (PEBA), polybutyleneterephthalate (PBT) homo- or copolymers, and/or polyvinylidenefluoride (PVDF). The insulation compounds are intended for use as wire insulation and in the fabrication of gaskets and liners. The compounds show superior resistance to refrigerants such as HCFC-22, HCFC-123, and HFC-134a. Crosslinking provides resistance to creeping under heat and pressure.
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