Physical vapor deposition system having reduced thickness backing plate
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United States of America Patent
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Apr 24, 2001
Grant Date -
N/A
app pub date -
Dec 3, 1998
filing date -
Jul 10, 1995
priority date (Note) -
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Abstract
A magnetron sputtering system is provided that uses cooling channels in the magnetron assembly to cool the target. The magnetron sputtering system also generates low pressure region in the magnetron assembly such that the backing plate sees a pressure differential much lower than atmospheric pressure. In one embodiment, the backing plate includes a center post to support the backing plate during operation. The backing plate is reduced in thickness and provides less of a barrier to the generated magnetic field.
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