Method and apparatus for conveying a workpiece
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United States of America Patent
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Apr 24, 2001
Grant Date -
N/A
app pub date -
Jun 4, 1997
filing date -
Jun 4, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A method and apparatus for conveying workpiece is used for conveying a workpiece such as a semiconductor wafer, glass substrate or liquid crystal panel between processing apparatuses when the workpiece is processed in a plurality of processing apparatuses. The method includes adjusting the amount of liquid on a surface of a workpiece to a predetermined amount, and conveying the workpiece which retains the predetermined amount of liquid between processes. The surface of the workpiece is kept wet by the liquid on the workpiece. The adjusting includes supplying a sufficient amount of liquid onto the surface of the workpiece which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.
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