Heat sink alignment apparatus and method
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United States of America Patent
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Apr 17, 2001
Grant Date -
N/A
app pub date -
Apr 23, 1999
filing date -
Apr 23, 1999
priority date (Note) -
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Abstract
The present invention provides a heat sink mounting apparatus for mounting a heat transfer device to an electronic substrate. In one embodiment, the present invention provides for a dielectric strip having a longitudinal axis and opposing first and second sides, with the second side abutting the substrate when the heat sink mounting apparatus is mounted on a substrate. The heat sink mounting apparatus has a series of resilient planar fingers that are disposed on, and extend approximately normal to, the first side of the strip, which fingers are configured to removably engage a thermal transfer device. Notches on the fingers releasably secure the thermal transfer device to the heat sink mounting apparatus.
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