Foil circuit boards and semifinished products and method for the manufacture thereof
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United States of America Patent
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Apr 17, 2001
Grant Date -
N/A
app pub date -
Jan 18, 1996
filing date -
May 18, 1994
priority date (Note) -
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Abstract
A method for the manufacture of printed circuit boards, foil circuit boards and semifinished products for printed and foil circuit boards formed from preliminary products with electrically conductive coatings (7, 8) structurable to conductor patterns and structurable substrates (4), for the formation of connectors (V), contours (K) and conductor patterns (L), the connectors (V), contours (K) and conductor patterns (L) being structured simultaneously or in the same method steps from the preliminary products, and the connectors (V) and contours (K) are part of the structured preliminary product substrate, the connectors (V) being brought for electrical or mechanical connection into a position in which they are connectable and the finished conductor patterns (L) can be separated at contours (K).
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