Apparatus for producing uniform coating thickness on a spherical substrate
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United States of America Patent
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Apr 10, 2001
Grant Date -
N/A
app pub date -
Apr 23, 1999
filing date -
Apr 23, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method are provided for applying a uniform liquid coating on a spherical semiconductor device. The present invention includes a multi functional process tube having an end which is covered by a liquid processing material which remains in place due to its surface tension and viscosity. Spherical semiconductor substrates are then dropped through the liquid material and become encapsulated by the fluid. At a subsequent stage in the process tube, vibratory motion is induced in the spheres to cause random motion along a linear combination of the three axes (x, y, z) and distribute the fluid material evenly around the surface of the sphere. The uniformly coated spheres then encounter a heating stage which cause the distributed processing material to become hardened and allow easier handling of the spherical semiconductor substrates for subsequent processing.
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