Method for making a bump
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United States of America Patent
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Apr 10, 2001
Grant Date -
N/A
app pub date -
Jan 5, 1999
filing date -
May 28, 1996
priority date (Note) -
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Abstract
A gold alloy wire in which 0.2 to 5.0% by weight of palladium (Pd) and 1 to 100 ppm by weight of bismuth (Bi) are added to gold having a purity of at least 99.99% by weight. Preferably, at least one element selected from the group consisting of yttrium (Y), lanthanum (La), calcium (Ca) and beryllium (Bi) in an amount of 3 to 250 ppm by weight is further added to said gold. The gold alloy wire is especially adapted to forming a gold bump.
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