Method and apparatus for component separation using microwave energy
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 3, 2001
Grant Date -
N/A
app pub date -
May 6, 1999
filing date -
May 6, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for separating and recovering components includes the steps of providing at least a first component bonded to a second component by a microwave absorbent adhesive bonding material at a bonding area to form an assembly, the bonding material disposed between the components. Microwave energy is directly and selectively applied to the assembly so that substantially only the bonding material absorbs the microwave energy until the bonding material is at a debonding state. A separation force is applied while the bonding material is at the debonding state to permit disengaging and recovering the components. In addition, an apparatus for practicing the method includes holders for the components.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully