Electronic circuit package with diamond film heat conductor
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United States of America Patent
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-
Apr 3, 2001
Grant Date -
N/A
app pub date -
Dec 18, 1998
filing date -
Jan 26, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic circuit device package of the type having a metal laminate base flange of molybdenum clad with copper on both faces has a CVD diamond film substrate inlaid in a well in the bottom of the base flange so that it is flush with the base flange surface. An opening in the opposite side of the base flange forms a chamber with the diamond as a floor to which the device may be bonded in intimate contact with the diamond substrate. The edges of the diamond are brazed with a gold-indium braze in intimate thermal contact with a shoulder of the well to maximize heat conduction from the edges of the diamond into the base flange. The base flange may be fastened to the flat surface of a heat sink member with the diamond in intimate thermal contact with the heat sink member.
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