Electrolyte and tin-silver electroplating process
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United States of America Patent
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Apr 3, 2001
Grant Date -
N/A
app pub date -
Feb 8, 1999
filing date -
Feb 12, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to an electrolyte for depositing tin-rich tin-silver alloys upon a substrate. This electrolyte includes a basis solution containing a solution soluble tin and silver compounds; a tin chelating agent of a polyhydroxy compound in an amount sufficient to complex tin ions provided by the tin compound; and a silver chelating agent of a heterocyclic compound in an amount sufficient to complex silver ions provided by the silver compound. Preferably, the tin and silver compounds are present in relative amounts to enable deposits containing about 85 to 99% by weight tin and about 0.5 to 15% by weight silver to be obtained.
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