Heating device containing a multi-lamp cone for heating semiconductor wafers
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United States of America Patent
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Apr 3, 2001
Grant Date -
N/A
app pub date -
Sep 9, 1998
filing date -
Sep 9, 1998
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Expired
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Abstract
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the present invention is directed to a heating device that contains at least one heating cone. The heating cone of the present invention includes a circular reflector that can be conically-shaped. A plurality of light energy sources are contained within the reflector. The light energy sources can be vertically oriented or can be tilted slightly towards the central axis of the heating cone. In this arrangement, it has been discovered that the heating cone produces a uniform irradiance distribution over a wafer being heated.
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