Film carrier and laminate type mounting structure using same
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United States of America Patent
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Mar 27, 2001
Grant Date -
N/A
app pub date -
May 19, 1998
filing date -
May 19, 1997
priority date (Note) -
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Abstract
A film carrier to be used for fabricating a new laminate type mounting structure, a new laminate type mounting structure comprising semiconductor elements mounted on the film carrier of the present invention and the laminate type mounting structure comprising a heat-releasing structure are provided. Due to the invention of the film carrier, handling of the semiconductor elements as well as fabrication of a laminate type mounting structure are facilitated. When a heat-releasing structure is added, the laminate type mounting structure of the present invention can advantageously efficiently release the heat generated by the semiconductor element in each layer.
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