Resistors for electronic packaging
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United States of America Patent
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Mar 27, 2001
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N/A
app pub date -
Apr 29, 1998
filing date -
Apr 29, 1998
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Abstract
In thin layer resistors comprising a patch of a layer of resistive material on an insulating substrate and means at spaced apart locations on the patch, the resistive material is formed of 95 to 99.5 wt % of a zero valence metal and between 5 and 0.5 wt % of a dielectric material.
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