Thermoplastic compound for filling pores in wooden materials
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United States of America Patent
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Mar 27, 2001
Grant Date -
N/A
app pub date -
Jan 22, 1999
filing date -
Jul 24, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thermoplastic compound useful in filling pores and voids in wooden materials, particularly edge regions, wherein the thermoplastic compound comprises a blend of two copolyesters and optionally fillers, wherein the first copolyester has a melting point of 140.degree. C. to 260.degree. C. and a glass transition temperature of -10.degree. C. to 80.degree. C., and wherein the second copolyester has a melting point of 120.degree. C. to 190.degree. C. and a glass transition temperature of -70.degree. C. to 10.degree. C. Also, a method of filling pores in a wooden material comprising using a thermoplastic compound having a softening point of 140.degree. C. to 200.degree. C., an open time of 2 to 15 seconds, and a viscosity number of 30 to 150 ml/g, with the thermoplastic compound preferably being a blend of two different copolyesters, wherein the application of such thermoplastic compounds enable the surfaces of chipboard panels and the like to be smoothed in a continuous one-pass process. In particular, immediate aftertreatment such as milling is possible through the use of the thermoplastic compounds.
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