Wiring board
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United States of America Patent
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Mar 27, 2001
Grant Date -
N/A
app pub date -
Oct 28, 1999
filing date -
Nov 2, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring board comprising an insulating substrate containing at least an organic resin, a plurality of electrically conducting wiring layers formed on the surface and/or inside of said insulting substrate, and via-hole conductors formed in said insulating substrate in order to electrically connect the plurality of electrically conducting wiring layers, wherein said via-hole conductors contain an organic binder as well as a Cu--Sn intermetallic compound as an electrically conducting component. The via-hole conductors formed in the wiring board exhibit a high electric conductivity and a large heat resistance, making it possible to very highly reliably connect the electrically conducting wiring layers together.
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