Lead frame structure
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United States of America Patent
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Mar 20, 2001
Grant Date -
N/A
app pub date -
Aug 10, 1999
filing date -
Aug 10, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The inner lead portion of the leads surrounds the die pad, but the die pad and the leads are on different planar surfaces.
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