Ultrasonic vibration bonding method
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United States of America Patent
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-
Mar 20, 2001
Issued Date -
N/A
app pub date -
Dec 7, 1999
filing date -
Dec 10, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An ultrasonic vibration bonding method comprising placing metal portions to be bonded formed on a base portion of a first member upon metal portions to be bonded of a second member, pressing the first and second members with a resonator and a mounting table elastically while the base portion of the first member is located on a bonding working portion side of the resonator and the second member is located on a mounting table side, and bonding together the portions to be bonded of the first and second members with ultrasonic vibration transmitted to the resonator from a transducer. This ultrasonic vibration bonding method can improve work efficiency and prevent a connection failure and resin breakage.
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