Process for manufacture of a microcircuit board permitting limitation of the mechanical stresses transmitted to the microcircuit and board thus obtained
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United States of America Patent
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Mar 6, 2001
Grant Date -
N/A
app pub date -
Jun 24, 1999
filing date -
Jul 7, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing a microcircuit board with a mechanical cut-out piece between the microcircuit and the board to limit stresses transmitted to the microcircuit. A blank of a network of conductors is created and the microcircuit is fixed in a container formed by shaping the blank, the microcircuit keeping the different parts of the network in position relative to each other and the module thus formed is installed in a cavity in the board by fixing the external connection areas onto the upper surface of the cavity.
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