Electrochemical stain prevention apparatus of submerged structure and process for producing submerged structure used in this apparatus

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United States of America Patent

PATENT NO 6197168
SERIAL NO

09426658

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Abstract

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An electrochemical stain prevention apparatus of a submerged structure comprising a submerged structure of which at least the stain prevention surface is formed of a conductive film that does not generate chlorine even by applying a potential of 5 V vs. SCE or less, a counter electrode located so as not to contact with the submerged structure, and a power supply unit for passing a direct current through the submerged structure having the conductive film formed thereon and the counter electrode. Aquatic organisms adhered to the surface of the conductive film can effectively be controlled by applying a potential of from 0.1 to 5 V vs. SCE to the submerged structure of such a stain prevention apparatus without generating chlorine. A potential applied to the conductive film of the submerged structure can be controlled with good accuracy by disposing a reference electrode between the submerged structure and the counter electrode. As the conductive film formed on the substrate of the submerged structure, a sprayed coating film made of a metal nitride can preferably be used.

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Patent Owner(s)

Patent OwnerAddress
PENTEL KABUSHIKI KAISHA7-2 NIHONBASHI KOAMI-CHO CHUO-KU TOKYO
TADASHI MATSUNAGA4-20-15 HON-CHO KOGANEI-SHI TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kadoi, Hideo Soka, JP 1 14
Matsunaga, Tadashi 4-20-15, Hon-cho, Koganei-shi, Tokyo 184-0004, JP 32 503
Murakami, Nobuyuki Chuo-ku, JP 16 173
Nakamura, Noriyuki Koganei, JP 66 699
Nakayama, Tsuruo Soka, JP 23 112
Ozawa, Kin-ichi Soka, JP 1 14
Takahashi, Hiromichi Soka, JP 34 500
Takimoto, Toshihiro Soka, JP 3 32
Wake, Hitoshi Soka, JP 6 39

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