Tape automated bonding method and bonded structure
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United States of America Patent
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Feb 27, 2001
Grant Date -
N/A
app pub date -
Sep 23, 1999
filing date -
Dec 27, 1995
priority date (Note) -
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Abstract
This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.
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