Solder sleeve and a method for the forming thereof
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United States of America Patent
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Feb 27, 2001
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N/A
app pub date -
Jul 30, 1998
filing date -
Dec 4, 1995
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Abstract
The invention relates to a solder sleeve comprising a split sleeve of solder material having end surfaces of which take the form of form-fitting coupling elements, and to a method for forming such a solder sleeve, comprising of: i) providing a strip of solder material having end surfaces of which take the form of form-fitting coupling elements; and ii) bending the strip to form a sleeve, wherein the coupling elements mutually engage for coupling.
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