Encapsulation and enclosure of electronic modules
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 20, 2001
Grant Date -
N/A
app pub date -
Jan 21, 1998
filing date -
Oct 28, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.
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