Heat sink for electric and/or electronic devices
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United States of America Patent
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-
Feb 20, 2001
Grant Date -
N/A
app pub date -
Nov 5, 1998
filing date -
Nov 5, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a material including whiskers.
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