Apparatus and method for a micromechanical electrostatic relay
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United States of America Patent
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Feb 20, 2001
Grant Date -
N/A
app pub date -
Feb 22, 2000
filing date -
Aug 22, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method for a micromechanical electrostatic relay that includes a base substrate and a carrier layer deposited onto the base substrate. The carrier layer includes an armature and stationary-contact spring tongues that engage each other at their respective free ends. Once engaged, the armature spring tongue moving contacts overlaps the respective stationary-contact spring tongue stationary contacts. During an electrostatic rest state, the armature and stationary-contact spring tongues curve away from the base substrate wherein their respective free ends no longer engage.
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