Method and connection arrangement for producing a smart card
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United States of America Patent
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Feb 20, 2001
Grant Date -
N/A
app pub date -
Jun 9, 1999
filing date -
Oct 9, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
The invention concerns a process and a connecting arrangement for producing a chip card, wherein a semiconductor chip on a module is fitted in an opening in a card carrier with the attainment of an electrical and mechanical connection. In accordance with the invention, in place of connections which were hitherto necessary involving a force-locking relationship and/or involving the materials being bonded together, recourse is made to inductive and/or capacitive coupling between the module and the IC-card. For that purpose the module and the card correspondingly have coils and/or capacitive coupling surfaces for signal transmission purposes.
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