Wafer sheet expanding apparatus and pellet bonding apparatus using thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 20, 2001
Grant Date -
N/A
app pub date -
Jan 22, 1999
filing date -
Nov 19, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer sheet expanding apparatus comprises an expanding mechanism, a rotating mechanism for the expanding mechanism, a motor, a power transfer mechanism. The expanding mechanism has a support ring, an expanding ring, and a movement mechanism. The support ring has a hole at a central part thereof and a circular annulus portion formed projectively on an outer-peripheral portion of the hole and an upper end for supporting a wafer sheet retained by a wafer ring. The expanding ring is disposed opposite the support ring and has an annular portion that is loosely fitted over the circular annulus portion. The movement mechanism causes relative movement of the support ring and the expanding ring. The expanding mechanism stretches the wafer sheet by relative movement of the support ring and the expanding ring. The power transfer mechanism connects the movement mechanism and the rotating mechanism to a motor selectively.
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