Monoblock structure for stacked components
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United States of America Patent
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Feb 13, 2001
Grant Date -
N/A
app pub date -
Feb 9, 1998
filing date -
Feb 10, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A monoblock structure comprises at least two stacked component levels, each component level comprising a layer of insulative material forming a component and encapsulation storey, at least one component and at least a first track a first end of which is connected to a connection point of the component. The structure further comprises at least one second track disposed laterally and a first end of which is connected to a second end of the first track. It additionally comprises a printed circuit forming a printed circuit storey and supporting at least one third track. A first end of the third track is coupled to a single input and/or output member one end of which is exposed on a face of the structure parallel to the component and printed circuit storeys and a second end of the third track is connected to a second end of the second track.
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