High precision three-dimensional alignment system for lithography, fabrication and inspection
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United States of America Patent
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Jan 30, 2001
Grant Date -
N/A
app pub date -
Feb 11, 1999
filing date -
Feb 11, 1999
priority date (Note) -
Expired
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Abstract
The present invention provides a high precision three-dimensional alignment system using SPM techniques and method of using the same. The system comprises a fine distance control unit for the effective three-dimensional micromovement in the nanometer range of a planar object, and proximity detection unit to monitor the alignment process. In the preferred embodiment, the fine distance control unit comprises a set of at least three strategically positioned fine distance control elements which are capable of controlled expansion and contraction in the nanometer range. The most preferred embodiment of the fine distance control element comprises a piezoelectric tube, which crystal size may be varied by varying an applied voltage. This system may be applied to microlithography, in which case the planar object is a scribing tool having a planar base with multiple tips fabricated on one surface.
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