Method for producing a contactless chip card
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United States of America Patent
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-
Jan 30, 2001
Grant Date -
N/A
app pub date -
Apr 13, 1999
filing date -
Oct 14, 1996
priority date (Note) -
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Abstract
A method of producing a contactless chip card (10) includes first the step of holding a chip (14), which is provided with terminal pads (16a, 16b) on a surface thereof, in a mould defining a chip-card substrate (12), in such a way that the chip surface provided with the terminal pads is located substantially in the same plane as a chip-card substrate surface defined by the mould. In addition, a chip-card substrate material is introduced into the mould, whereupon a coil structure (18) is applied by screen-printing a conductive paste onto the chip-card substrate (12) in such a way that the coil structure (18) extends up to the terminal pads (16a, 16b) on the chip.
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