Missing wire detector
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 30, 2001
Grant Date -
N/A
app pub date -
Dec 22, 1999
filing date -
Jun 16, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for monitoring the presence of a bonding wire in a wire bonding machine. The apparatus generates an AC signal which is coupled to the bonding tool. A sensor senses a current of the AC signal flowing to the bonding tool and a current of the AC signal returned from the bonding tool. The current flows are compared to one another to determine the presence or absence of the bonding wire in the bonding tool.
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