Method of cutting a ceramic base plate
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United States of America Patent
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-
Jan 23, 2001
Grant Date -
N/A
app pub date -
Jul 27, 1998
filing date -
Jul 31, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for cutting a ceramic base plate with which the process efficiency is improved, a stable cutting resistance can be maintained during the cutting process, and excellent process precision can be achieved, a wherein supporting plate which is used for the cutting of the ceramic base plate has a structure of a sealed surface layer which has been impregnated with glass components into both surfaces of the sintered porous alumina body. The supporting plate is fixed on a stage of a cutting machine along a forward direction of the rotary cutting blade through a vacuum-absorption and the ceramic base plate as a work-piece is wax-bonded to the supporting plate. While rotating the rotary cutting blade, first of all, the supporting plate is cut so that the blade is dressed/sharpened with the sintered porous alumina body. In the next step, the ceramic base plate is cut and the cutting whetstone blade cuts the supporting plate to a certain depth, so that the rotary cutting blade will contact to the ceramic base plate, then sintered porous alumina body of the supporting plate. As a result, the dressing/sharpening the blade can always be performed, and at the same time the ceramic base plate can be cut while keeping the cutting resistance at low level.
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