Socket for IC and method for manufacturing IC
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jan 16, 2001
Grant Date -
N/A
app pub date -
Sep 28, 1999
filing date -
Jan 16, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A socket for an IC used in electrically connecting the IC to a test device for testing electrical properties of the IC. The socket for an IC includes a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to the contact electrodes, an anisotropic electrically conductive adhesive arranged on the contact electrodes of the printed circuit board, a base block arranged on the one surface of the printed circuit board and having an opening for setting the IC, with the opening facing the anisotropic electrically conductive adhesive. The socket for an IC also includes a plurality of coil-shaped contacts arranged in the opening, one ends of which are positioned above the contact electrodes via the anisotropic electrically conductive adhesive and the other ends of which are protruded from the opening. The contact electrodes and the coil-shaped contacts facing each other via the anisotropic electrically conductive adhesive are mechanically and electrically connected to each other via the anisotropic electrically conductive adhesive.
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