Surface treating agent for plating and base material with the plating adhered thereto
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United States of America Patent
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-
Jan 9, 2001
Grant Date -
N/A
app pub date -
Apr 26, 1996
filing date -
Apr 28, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A layer is provided for bonding a conductive plating to a substrate which substrate normally does not provide firm bonding of plating directly thereto. The bonding layer forms a matrix in which are dispersed ultrafine metal particles. The bonding layer is formed in situ on the substrate surface with the metal particles being maintained unaggregated in the matrix as it is formed on the surface. Plating subsequently formed on the outer surface of the bonding layer is effectively firmly bonded to the substrate through the intermediary of the matrix and metal particles distributed therein. The bonding layer includes a fixative formed of an organic compound including a metal and an organic solvent. The bonding layer may further include a film strengthener.
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