Integrated circuit connection using an electrically conductive adhesive
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United States of America Patent
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-
Jan 2, 2001
Grant Date -
N/A
app pub date -
Mar 12, 1998
filing date -
Mar 12, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rests on the seating portion (403) of the leads (302) of the integrated circuit (300), and so that the stem portion (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400). An electrically conductive epoxy adhesive (602) is then dispensed into the holes (401) having the leads (302) therein, and cured to form a solid, electrical, and mechanical connection between the printed circuit board (400) and integrated circuit (300).
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