Copper foil and laminate containing a hydrogen inhibitor
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United States of America Patent
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Jan 2, 2001
Grant Date -
N/A
app pub date -
Mar 1, 1999
filing date -
Sep 4, 1997
priority date (Note) -
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Abstract
This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.
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